改性AlN/磷片石墨/环氧树脂层状结构复合材料的制备与性能
Preparation and Performances of Modified AlN/FG/Epoxy-Resin Composite Materials with Layered Structures
吕品 1杨明君 1肖清林 1张益铭 1卢雨晴 1易崇森1
作者信息
- 1. 西南石油大学新能源与材料学院,四川 成都 610500
- 折叠
摘要
环氧树脂(EP)作为被应用最为广泛的电子封装绝缘材料,但由于其较低的热导率[0.1～0.3 W/(m·K)]及在X波段较差的电磁屏蔽效能(1～2 dB),影响了电子元器件的服役寿命及信号稳定.本文利用芬顿反应改性鳞片石墨(FG)和硅烷偶联剂(KH560)改性氮化铝(AlN)作为填料,利用自沉降机制制备了具有分层结构环氧树脂基复合材料.结果表明,当改性氮化铝与改性鳞片石墨体积分数分别为 2%和 8%时,导热系数为 0.60 W/(m·K),10 GHz的电磁屏蔽效能为 17.1 dB,相较于纯树脂,热导率与电磁屏蔽值分别提升了 3 倍和 8 倍,同时仍保持着较高的电绝缘性能(鳞片石墨沉积测表面电阻率7.78×108 Ω,体积电阻率4.91×1011 Ω·cm).
Abstract
Epoxy resin(EP)is the most widely used electronic packaging insulation material,but its low thermal conductivity[0.1-0.3 W/(m·K)]and poor electromagnetic shielding efficiency(1-2 dB)in the X-band affect the service life and signal stability of electronic components.The Fenton reaction was used to modify the flake graphite(FG),and the aluminum nitride(AlN)modified by silane coupling agent(KH560)was used as fillers.The epoxy-resin-based composite materials with layered structures were prepared by using the self-sedimentation mechanism.The results show that when the volume fractions of modified AlN and modified flake graphite are respectively2%and8%,the thermal conductivity of the composite material is0.60 W/(m·K),and the electromagnetic shielding value at 10 GHz is 17.1 dB.Compared with the pure resin,the thermal conductivity and electromagnetic shielding value of the composite material are respectively increased by three and eight times,and the composite material still maintains high electrical insulation performances.Its surface resistivity measured by the flake graphite deposition is 7.78×108 Ω and the volume resistivity is 4.91×1011Ω·cm.
关键词
环氧树脂/芬顿改性/层状结构/热导率/电磁屏蔽效能Key words
Epoxy Resin/Fenton Modification/Layered Structure/Thermal Conductivity/Electromagnetic Shielding Efficiency引用本文复制引用
基金项目
黑龙江省重点研发计划"揭榜挂帅"项目(2023ZXJ06A05)
出版年
2024
NETL
NSTL
万方数据