Preparation and Performances of Modified AlN/FG/Epoxy-Resin Composite Materials with Layered Structures
Epoxy resin(EP)is the most widely used electronic packaging insulation material,but its low thermal conductivity[0.1-0.3 W/(m·K)]and poor electromagnetic shielding efficiency(1-2 dB)in the X-band affect the service life and signal stability of electronic components.The Fenton reaction was used to modify the flake graphite(FG),and the aluminum nitride(AlN)modified by silane coupling agent(KH560)was used as fillers.The epoxy-resin-based composite materials with layered structures were prepared by using the self-sedimentation mechanism.The results show that when the volume fractions of modified AlN and modified flake graphite are respectively2%and8%,the thermal conductivity of the composite material is0.60 W/(m·K),and the electromagnetic shielding value at 10 GHz is 17.1 dB.Compared with the pure resin,the thermal conductivity and electromagnetic shielding value of the composite material are respectively increased by three and eight times,and the composite material still maintains high electrical insulation performances.Its surface resistivity measured by the flake graphite deposition is 7.78×108 Ω and the volume resistivity is 4.91×1011Ω·cm.
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