一种无溶剂型电子封装用导电胶的研制
Research of Non-solvent Electrically Conductive Adhesive for Electronic Packaging
宋燕汝 1柯杰曦 1李晓娟 1易荣军 1王峰 1王洪 1周建文1
作者信息
- 1. 中蓝晨光化工研究设计院有限公司,四川 成都 610041;中蓝晨光化工有限公司,四川 成都 610041
- 折叠
摘要
为了解决导电胶黏剂因综合性能不足而导致大规模应用的受限,本文以酚醛环氧、多官能环氧为导电胶树脂基体,选用了4,4′-二氨基二苯砜(DDS)作为固化剂,片状银粉作为导电填料,通过调节银粉和固化剂的用量,制备了有良好流变性、导电性、力学性能的导电胶.通过分析测试,得到导电胶的黏度为 32 800 mPa·s,触变指数为 4.0,体积电阻率为 4.34×10-4 Ω·cm,剪切强度为17 MPa,热导率为3.96 W/(m·K),Cl-、Na+和K+分别仅为6.79×10-5、6.31×10-5和<10-5.该导电胶综合性能优异,可应用于电子元器件及其他导电导热功能性材料的粘接.
Abstract
In order to solve the limitation of large-scale application of electrically conductive adhesives due to insufficient comprehensive performances,phenolic epoxy and multi-functional epoxy were used as the resin matrix of electrically conductive adhesives,4,4′-diaminodiphenyl sulfone(DDS)was selected as the curing agent,and flake silver powder was used as the conductive filler.By adjusting the amounts of silver powder and curing agent,an electrically conductive adhesive with good rheology,conductivity and mechanical properties was prepared.Through analysis and testing,the viscosity of the electrically conductive adhesive is 32 800 mPa·s,the thixotropic index is 4.0,the volume resistivity is 4.34×10-4 Ω·cm,the shear strength is 17 MPa,and the thermal conductivity is3.96 W/(m·K).The contents of Cl-,Na+and K+in the electrically conductive adhesive are only6.79×10-5,6.31×10-5 and smaller than 10-5.The electrically conductive adhesive has excellent comprehensive properties and can be applied to bond the electronic components and other conductive and thermal conductive functional materials.
关键词
环氧树脂/导电胶/粘接/银粉/电子封装Key words
Epoxy Resin/Electrically Conductive Adhesive/Bond/Silver Powder/Electronic Packaging引用本文复制引用
出版年
2024
NETL
NSTL
万方数据