Research of Non-solvent Electrically Conductive Adhesive for Electronic Packaging
In order to solve the limitation of large-scale application of electrically conductive adhesives due to insufficient comprehensive performances,phenolic epoxy and multi-functional epoxy were used as the resin matrix of electrically conductive adhesives,4,4′-diaminodiphenyl sulfone(DDS)was selected as the curing agent,and flake silver powder was used as the conductive filler.By adjusting the amounts of silver powder and curing agent,an electrically conductive adhesive with good rheology,conductivity and mechanical properties was prepared.Through analysis and testing,the viscosity of the electrically conductive adhesive is 32 800 mPa·s,the thixotropic index is 4.0,the volume resistivity is 4.34×10-4 Ω·cm,the shear strength is 17 MPa,and the thermal conductivity is3.96 W/(m·K).The contents of Cl-,Na+and K+in the electrically conductive adhesive are only6.79×10-5,6.31×10-5 and smaller than 10-5.The electrically conductive adhesive has excellent comprehensive properties and can be applied to bond the electronic components and other conductive and thermal conductive functional materials.
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