Polyimide(PI)is regarded as the most promising substrate for flexible electronic devices owing to its exceptional comprehensive properties.The next generation of the electronic component is moving towards the direction of low-dimensional,large-scale,and refined integration,which imposes higher demands on PI as an interlayer insulating material.However,the dielectric constant of conventional aromatic PI is too high to be directly applied in the microelectronics industry.Therefore,there is an urgent need to develop new methods to reduce the PI dielectric constant.This paper reviewed recent researches and systematic works of PI with a low or ultra-low dielectric constant,aiming to offer some novel solutions for the development of PI with a low or ultra-low dielectric constant and provide a new perspective for PI processing technology.
关键词
低/超低介电常数/聚酰亚胺/本征结构/多孔结构
Key words
Low or Ultra-low Dielectric Constant/Polyimide/Intrinsic Structure/Porous Structure
维普
万方数据