首页|低/超低介电常数聚酰亚胺的研究进展

低/超低介电常数聚酰亚胺的研究进展

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聚酰亚胺(PI)是综合性能最佳的有机高分子材料之一,被认为是最具潜力的柔性电子器件基材.下一代电子元器件正向低维度、大规模及精细化集成发展,对作为层间绝缘材料的PI提出了更高的要求,而普通芳香族PI介电常数偏高,无法直接应用于微电子工业领域.因此,当前急需开发降低PI材料介电常数的新方法.本文综述了近年来低/超低介电常数PI的相关研究和系统性工作,希望这些综合性归纳能为低、超低介电常数PI的构筑提供新方案,也为PI的加工工艺提供新的视角.
Research Progress of Polyimide with Low or Ultra-low Dielectric Constant
Polyimide(PI)is regarded as the most promising substrate for flexible electronic devices owing to its exceptional comprehensive properties.The next generation of the electronic component is moving towards the direction of low-dimensional,large-scale,and refined integration,which imposes higher demands on PI as an interlayer insulating material.However,the dielectric constant of conventional aromatic PI is too high to be directly applied in the microelectronics industry.Therefore,there is an urgent need to develop new methods to reduce the PI dielectric constant.This paper reviewed recent researches and systematic works of PI with a low or ultra-low dielectric constant,aiming to offer some novel solutions for the development of PI with a low or ultra-low dielectric constant and provide a new perspective for PI processing technology.

Low or Ultra-low Dielectric ConstantPolyimideIntrinsic StructurePorous Structure

李欣膂、梁昊、陈婷、徐伊凡、陈嘉敏、刘学清、陈风、刘继延

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江汉大学光电化学材料与器件教育部重点实验室,湖北 武汉 430056

江汉大学光电材料与技术学院,湖北 武汉 430056

低/超低介电常数 聚酰亚胺 本征结构 多孔结构

国家重点研发计划江汉大学一流学科建设重大专项江汉大学重大创新支持计划湖北省创新团队项目

2022YFB36037022023XKZ0342023ZDCX01T201935

2024

塑料工业
中蓝晨光化工研究院有限公司

塑料工业

CSTPCD北大核心
影响因子:0.685
ISSN:1005-5770
年,卷(期):2024.52(5)