摘要
高频、大功率的现代电子产品趋向于小型化和集成化,热量的积累可能导致先进电子器件失效甚至损坏.聚合物基复合材料是目前电子器件散热的主要材料.本文主要对以银纳米线为主要填料的高导热复合材料的制备方法进行了综述,包括共混法、冻干法、涂层法、浇铸法、静电纺丝法、自组装法,旨在为新型热管理材料的制备和研究提供一些参考.
Abstract
High-frequency and high-power modern electronic products tend to be miniaturized and integrated,but the accumulation of heat might lead to the failure or even damage of advanced electronic devices.Currently,polymer-based composites are the main materials for the heat dissipation of electronic devices.This paper mainly reviewed the preparation methods of silver nanowire/polymer composites with high thermal conductivity,such as the blending method,freeze-drying method,coating method,casting method,electrostatic spinning method,and self-assembly method.This paper aimed to provide some references for the preparation and research of new thermal management materials.
基金项目
中国博士后科学基金(2017M611757)
上海市科技人才计划(19QB1402200)
上海市科委"科技创新行动计划"地方院校能力建设项目(19040501800)
上海市科委"科技创新行动计划"地方院校能力建设项目(18DZ1113100)
上海市高水平地方高校创新团队(海事安全与保障)项目()
维普
万方数据