高频柔性覆铜板用低介电聚酰亚胺研究进展
Research Progress of Low-Dielectric Polyimide for High-Frequency Flexible Copper-Clad Laminates
谷元 1杨海洋 1李炜 1彭庆1
作者信息
- 1. 株洲时代新材料科技股份有限公司,湖南 株洲 412000
- 折叠
摘要
随着5G通信技术的快速发展,迫切需要在高频下具有低介电常数(Dk)和低介电损耗(Df)的高性能聚合物作为介电材料.聚酰亚胺(PI)以其优异的综合性能,在柔性基板领域应用广泛.然而普通PI在高频下具有较高的Dk和Df,难以满足5G或更高通信频率的实际应用需求.本文从改变PI的本体结构和引入聚酯结构2 个方面,重点综述了近年来低介电PI薄膜的研究进展,并对高频下低介电高分子材料的发展前景进行了展望.
Abstract
With the rapid developments of the 5G communication technology,high-performance polymers with low dielectric constant(Dk)and low dielectric loss(Df)at high frequencies are urgently needed.Polyimide(PI)with excellent comprehensive performances is widely used in the field of flexible printed circuits.However,common PI shows relatively high Dk and Df at high frequencies,which is difficult to meet the practical application requirements of 5G or higher communication frequencies.This review summarized the research progress of low dielectric PI films in recent years from two aspects:changing the intrinsic structures of PI and introducing polyester structures.Besides,the future developments of low dielectric polymer materials at high frequencies were prospected.
关键词
聚酰亚胺/结构改性/聚酯酰亚胺/介电常数/介电损耗/高频Key words
Polyimide/Structural Modification/Polyesterimide/Dielectric Constant/Dielectric Loss/High Frequency引用本文复制引用
出版年
2024
NETL
NSTL
万方数据