Research Progress of Low-Dielectric Polyimide for High-Frequency Flexible Copper-Clad Laminates
With the rapid developments of the 5G communication technology,high-performance polymers with low dielectric constant(Dk)and low dielectric loss(Df)at high frequencies are urgently needed.Polyimide(PI)with excellent comprehensive performances is widely used in the field of flexible printed circuits.However,common PI shows relatively high Dk and Df at high frequencies,which is difficult to meet the practical application requirements of 5G or higher communication frequencies.This review summarized the research progress of low dielectric PI films in recent years from two aspects:changing the intrinsic structures of PI and introducing polyester structures.Besides,the future developments of low dielectric polymer materials at high frequencies were prospected.
PolyimideStructural ModificationPolyesterimideDielectric ConstantDielectric LossHigh Frequency
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