Synthesis and Applications of Quaternary Copolymer Polyimide
The introduction of ether or ketone bonds with lower rotational barrier into polyimide(PI)could increase the flexibility of the molecular chain and effectively improve the stick force of PI.In this paper,with a two-step method,one kind of tetrameric copolymerized PI film was prepared by the in-situ polycondensation of 4,4′-diaminodiphenyl ether(ODA)containing flexible ether bonds,3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride(BTDA)containing flexible ketone bonds,biphenyl tetracarboxylic acid dianhydride(BPDA)with a non-coplanar twisted structure,and 1,4-diaminobenzene(PPDA).The results show that the copolymerized PI film has a glass transition temperature of 237.1℃,a 10%thermal decomposition temperature of 538.1℃,a tensile strength of 139.64 MPa,an elongation at break of 22.29%,and a modulus of elasticity of 3.12 GPa.The peel strength of the PI film after imidization for the copper foil is increased from 0.62 N/mm to 0.94 N/mm,which was prepared by adding the talc filler with a mass fraction of 0.5%to N,N-dimethylacetamide(DMAc)solution prior to the monomer polymerization.
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