The introduction of ether or ketone bonds with lower rotational barrier into polyimide(PI)could increase the flexibility of the molecular chain and effectively improve the stick force of PI.In this paper,with a two-step method,one kind of tetrameric copolymerized PI film was prepared by the in-situ polycondensation of 4,4′-diaminodiphenyl ether(ODA)containing flexible ether bonds,3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride(BTDA)containing flexible ketone bonds,biphenyl tetracarboxylic acid dianhydride(BPDA)with a non-coplanar twisted structure,and 1,4-diaminobenzene(PPDA).The results show that the copolymerized PI film has a glass transition temperature of 237.1℃,a 10%thermal decomposition temperature of 538.1℃,a tensile strength of 139.64 MPa,an elongation at break of 22.29%,and a modulus of elasticity of 3.12 GPa.The peel strength of the PI film after imidization for the copper foil is increased from 0.62 N/mm to 0.94 N/mm,which was prepared by adding the talc filler with a mass fraction of 0.5%to N,N-dimethylacetamide(DMAc)solution prior to the monomer polymerization.
NETL
NSTL
万方数据
