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柔性高分子泡沫压力传感器研究进展

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柔性泡沫压力传感器具有良好的柔韧性、延展性、可压缩变形以及高灵敏度等特点,是发展人机交互、可穿戴电子、智能机器人等领域的核心器件.随着应用需求的增加,研究人员希望开发出更高性能的材料来制备柔性泡沫压力传感器,聚合物导电泡沫复合材料因其优异的力学性能、良好的化学性能且易于控制而成为首选.本综述重点关注了基于不同材料、制备工艺、性能和应用的柔性泡沫压力传感器最新研究进展,介绍了用于制备泡沫基底的不同聚合物材料(如聚二甲基硅氧烷、聚氨酯、聚偏二氟乙烯等)和用于制备导电泡沫的不同导电填料(金属纳米粒子、石墨烯、聚吡咯等),对比了常用柔性泡沫压力传感器制备工艺(包括原位聚合、喷涂、浸涂、共混等)的优点与局限性,提出了提高柔性泡沫压力传感器灵敏度和检测范围等性能参数的方法和机制,同时展望了柔性泡沫压力传感器在健康监测领域的应用前景.
Research Progress of Flexible Polymer Foam Pressure Sensors
Flexible foam pressure sensors,characterized by excellent flexibility,stretchability,conformability,and high sensitivity,have emerged as the key components in the human-machine interactions,wearable electronics,smart robotics,and related fields.With the increasing application demands,researchers aim to develop higher-performance materials for fabricating flexible foam pressure sensors.Polymer-based conductive foam composites are preferred due to their outstanding mechanical properties,good chemical properties,and strong controllability.This review focused on the latest research progresses of flexible foam pressure sensors based on different materials,fabrication processes,properties,and applications.The different polymer materials(such as polydimethylsiloxane,polyurethane,polyvinylidene fluoride,etc.)used to prepare the foam bases and the different conductive fillers(metal nanoparticles,graphene,polypyrrole,etc.)used to prepare the conductive foams were introduced.Advantages and limitations of the common preparation processes of flexible foam pressure sensors(including in-situ polymerization,spraying,dipping,blending,etc.)were compared.The methods and mechanisms to improve the sensitivity and detection range of the flexible foam pressure sensors were presented,and the application prospects of the flexible foam pressure sensors in the field of health monitoring were forecasted.

Pressure SensorConductive FillerPolymer MatrixFoam

胡名鹤、李欣夏、陈勇前、刘世友、唐昶宇、邵虹

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中物院成都科学技术发展中心,四川 成都 610200

压力传感器 导电填料 聚合物基体 泡沫

国家安全学术(NSAF)基金四川省科技项目

U19302042022JDJQ0020

2024

塑料工业
中蓝晨光化工研究院有限公司

塑料工业

CSTPCD北大核心
影响因子:0.685
ISSN:1005-5770
年,卷(期):2024.52(7)