Synthesis of Low-temperature Curing and Low-dielectric Polyimide and Its Applications on the Copper-Clad Laminates
To reduce the dielectric properties of polyimide(PI)materials as well as the imidisation temperature to obtain the PI copper-clad laminates with better performances,four kinds of monomers including 4,4′-(hexafluoroisopropenyl)diphthalic anhydride(6FDA),4,4′-diaminodiphenyl ether(ODA),1,3-bis(4′-aminophenoxy)benzene(TPE-R),and bisphenol polyphenol dibasic ether dianhydride(BPADA)were used to synthesize the polyamido acid(PAA)solution.Three kinds of catalysts[quinoline(QL),benzimidazole(BI),and triethylamine(Et3N)]that could reduce the imidisation temperature were introduced into the PAA solution.Then the PI materials were prepared by the thermal imidisation at a lower temperature.The thermal stabilities,tensile properties,adhesive properties and optical properties of samples were characterized.The results show that the PI films cured by the three catalysts possess good thermal stability and excellent optical properties.The tensile strength(70.23 MPa)of PI/QL is the best,the water absorption of PI/QL is reduced to 0.26％,the dielectric constant(2.54)of PI/Et3N is the lowest,PI/Et3N is able to maintain the peel strength of the original PI(1.56 N/mm).Among the three kinds of low temperature curing PI films,the maximum soldering temperature is 296℃.
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