Preparation and Performance Evaluations of Thermal Conductive Epoxy Resins with Low Linear Expansion Coefficient
Higher requirements on the heat dissipation and low linear expansion coefficient of epoxy resin materials have been put forward with the development of the continuously integrated and refined electronic devices.In the epoxy resin matrix,the poor dispersion of silica micro-powder without surface modification leads to the limited use of the prepared epoxy materials under special conditions.To overcome the above problems,this paper adopted silane coupling agent KH550 to carry out the surface modification of the silica micro-powder.The modification effects of silica micro-powder,as well as the mechanical properties,electrical insulation properties and thermal stability of the composite materials were also systematically evaluated.The results show that the aggregation degree and surface hydrophilicity of silica micro-powder are changed after the modification with KH550,which brings about better mechanical properties,electrical insulation properties and thermal stability of the prepared composites.For the epoxy composite with the 70%mass fraction modified silica micro-powder,its thermal conductivity and linear expansion coefficient are respectively 0.787 W/(m·K)and 2.83×10-5℃-1,which are respectively432%and46%of those of pure epoxy resin and are also better than those of the composites with the same mass fraction unmodified silica micro-powder[0.702 W/(m·K)and3.41×10-5℃-1].
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