Modern electronic component assembly technology,with the miniaturization and miniaturization of electronic components,as well as the device spacing,opening size is getting smaller and smaller,and the stencil thickness is getting thinner and thinner.In order to increase the solder paste release rate,electrocast steel plates or laser steel plates with nano-coating are generally used,and at the same time,a fully automated and intelligent solder paste press(screen printing machine)with high printing accuracy is also selected.
万方数据
