摘要
以半导体先进封装技术中的SiP、IGBT、Chiplet、SiC、AMB等为实例,介绍了新网版印刷技术在其中的工艺、作用及技术创新.
Abstract
Taking SiP,IGBT,Chiplet,SiC,AMB and other advanced semiconductor packaging technologies as examples,the process,function and technical innovation of new screen printing technology are introduced.
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