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漫话半导体先进封装技术中的新网版印刷(四)

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先进封装技术通过平面与空间上的革新,实现连接的密集化、堆叠的多样化和功能的系统化,从平面向三维发展,从功能化向智能化发展.网版印刷技术参与到先进封装制造技术之中,完成诸如SiP类芯片的封装工作.
Through the innovation of plane and space,advanced packaging technology realizes the densification of connections,the diversification of stacks and the systematization of functions,from the flat to the three-dimensional development,from the functional to the intelligent development.Screen printing technology is involved in advanced packaging manufacturing technology to complete the packaging work such as SiP chip.

advanced packaging technologyfunctionalintelligentscreen printing technologySiP chip

熊祥玉、巢亚平、陈港能、李蓉

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先进封装 功能化 智能化 网版印刷技术 SiP芯片

2024

丝网印刷
中国丝网及制像协会 北京市印刷技术研究所

丝网印刷

影响因子:0.061
ISSN:1002-4867
年,卷(期):2024.(23)