漫话半导体先进封装技术中的新网版印刷(四)
熊祥玉 巢亚平 陈港能 李蓉
摘要
先进封装技术通过平面与空间上的革新,实现连接的密集化、堆叠的多样化和功能的系统化,从平面向三维发展,从功能化向智能化发展.网版印刷技术参与到先进封装制造技术之中,完成诸如SiP类芯片的封装工作.
Abstract
Through the innovation of plane and space,advanced packaging technology realizes the densification of connections,the diversification of stacks and the systematization of functions,from the flat to the three-dimensional development,from the functional to the intelligent development.Screen printing technology is involved in advanced packaging manufacturing technology to complete the packaging work such as SiP chip.
关键词
先进封装/功能化/智能化/网版印刷技术/SiP芯片Key words
advanced packaging technology/functional/intelligent/screen printing technology/SiP chip引用本文复制引用
出版年
2024
NETL
NSTL
万方数据