SiP packaging technology has become one of the most important technologies in the semiconductor industry.In order to maximize the efficiency of the chip,minimize the volume after packaging,and customize the chip,the development of the chip has also shifted from the pursuit of power consumption reduction and performance improvement to more pragmatic to meet the needs of the market.This paper introduces the screen printing process and strict requirements ofSiP packaging technology,and the development trend of mass production in non-semiconductor industry by using the existing SMT solder paste screen printing equipment.
万方数据
维普
