首页|电流密度对单晶铜棒材电化学冷拉拔的影响

电流密度对单晶铜棒材电化学冷拉拔的影响

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通过显微维氏硬度计、电子背散射衍射和透射电子显微镜等分析手段研究了不同电流密度对单晶铜棒材电化学冷拉拔过程中拉拔力、硬度、晶体取向及位错的影响.结果表明,当电流密度为6.7 mA·cm-2时,激活的滑移系数量最多,拉拔力最小,且拉拔后棒材的表面硬度也最小.不同的电流密度使单晶铜棒材的塑化程度不同,其主要原因是由于晶体内滑移系激活数量不同引起,导致位错易于运动,使得位错缠结减少.而在更高的电流密度下,由于表面腐蚀层厚度的增加,激活的滑移系数量减少,继而摩擦力增大,位错密度增大,使得拉拔力再次增大.
Effect of current density on electrochemical cold drawing of single crystal copper bar
The effects of different current densities on the drawing force,hardness,crystal orientation and dislocation during electrochemi-cal cold drawing process of single crystal copper bars were studied through analysis methods such as micro Vickers hardness tester,electron backscatter diffraction and transmission electron microscopy.The results show that when the current density is 6.7 mA·cm-2,the number of activated slip systems is the most,the drawing force is the smallest,and the surface hardness after drawing is also the smallest.Differ-ent current densities result in different degrees of plasticization of single crystal copper bars,mainly due to the different number of activa-ted slip systems within the crystal,which results in dislocations easy to move and reduces dislocation entanglement.With higher current densities,as the thickness of the surface corrosion layer increases and the number of activated slip systems decreases,the friction force in-creases and the dislocation density increases,resulting in further increase of drawing force.

electrochemical cold drawingelectrochemical corrosionslip systemdislocationsoftening

崔智慧、陈体军

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兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室,甘肃兰州 730050

电化学冷拉拔 电化学腐蚀 滑移系 位错 软化

国家自然科学基金

51971105

2024

塑性工程学报
中国机械工程学会

塑性工程学报

CSTPCD北大核心
影响因子:0.46
ISSN:1007-2012
年,卷(期):2024.31(3)
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