Effect of annealing temperature on forming quality of pure copper foils for micro deep drawing
T2 copper foils with thickness of 50 μm were selected and annealed at 300-700℃for 5 min and subjected to characterization tests,mechanical properties tests and micro deep drawing(MDD)tests.The mechanical properties of copper foils at different annealing temperatures were systematically studied,and the influence laws of annealing temperature on the forming quality of copper foils micro deep drawing forming parts were investigated.The results show that for the annealed copper foils,the yield strength decreases and the elon-gation tends to increase firstly and then decrease with the progress of recrystallization and grain growth.The formability of the original state copper foil is poor,and the complete cup-shaped parts cannot be formed by MDD.When the annealing temperature is 500℃,the copper foil recrystallization is completed,few wrinkles are characterized on the forming parts and high surface quality is obtained.With the further increase of annealing temperature,wrinkling on the surface becomes apparent.500℃is optimal annealing temperature for copper foils,which can significantly improve the forming accuracy and forming quality of the copper foils micro deep drawing forming parts.
micro deep drawingcopper foilannealing temperaturewrinklingformability
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