Preparation and high temperature resistance of AlO(OH)/polyimide composite films
Polyimide(PI)composite films were prepared by the sol-gel method using 4,4'-diaminodiphe-nyl ether(ODA)as the diamine monomer,phthalic anhydride(PMDA)as the anhydride monomer,3-aminopropyltriethoxysilane(KH550)as the coupling agent,and isopropanol aluminum[Al(OPri)3]as the aluminum source.PI was used as the matrix,and AlO(OH)served as the reinforcement phase.The structure and properties of the composite films were characterized by SEM,FTIR,XRD,TG,DSC,water contact angle measurement,paint film marker,and pencil scratch tester.The results show that the thermal stability of the composite films first increases and then decreases with the increase of the content of alumi-num sol.When the content of aluminum sol is 10％,the A1O(OH)/PI composite films exhibits the best high-temperature resistance,with the 5％weight loss temperature reaching 567 ℃ and the glass transition temperature of 381.4 ℃.
polyimidehigh temperature resistancethermal stabilitycomposite films
万方数据
维普
