A review of research on friction lubrication and chemical behavior in chemical mechanical polishing
The research on friction and chemical behavior in CMP process is reviewed.The relevant arti-cles are mainly divided into three aspects:Experimental study on the effect of chemical components in polishing fluid on the tribological lubrication state of wafer,molecular dynamics simulation of the reaction between polishing fluid components and wafer surface materials in CMP process and molecular dynamics simulation of reaction force field,CMP material removal rate model considering both tribological lubrica-tion and chemical reaction.The mechanism of mechanical and chemical synergies in CMP process is still unclear,considering the synergies between mechanical friction and chemical reaction is one of the impor-tant research directions to improve the theoretical framework of CMP in the future.
chemical mechanical polishingmechanochemical synergytribochemistrycoefficient of frictionmolecular dynamics
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