Study on removal of copper and magnesium ions from tungstate solution by chelating resin
The ion exchange method was used to select CH-93 chelating resin and LSC-500 chelating resin with high selectivity for copper and magnesium ions to deeply remove copper and magnesium ions from tungstate solution,explore the influence of different factors on the adsorption effect,and analyze the ad-sorption type,adsorption thermodynamics and kinetics.The results show that the adsorption rate of copper and magnesium ions can reach more than 99%under different adsorption parameters.Thermodynamics studies shows that the adsorption of copper and magnesium ions by resin is a spontaneous,endothermic and entropic process.The kinetic studies show that the adsorption process of copper and magnesium ions by resin conforms to Langmuir isothermal adsorption model and quasi-second-order kinetic model,and liq-uid film diffusion is a rate-controlling step.The ion exchange results on the column showed that after 12 h adsorption by CH-93/LSC-500 resin,the content of copper and magnesium ions decreased from 60 000 μg/L to 14.6,24.4 μg/L,respectively,without leakage.