摘要
为了检测半导体靶材内部氧化物杂质、未焊合、空隙等缺陷,且在检测过程中不对产品造成损伤,提出了一种利用超声波的半导体靶材自动检测系统.该系统采用相控阵探头水浸检测,三轴移动系统中X轴和Y轴检测速度达到 1000mm/s,可对铜、铝、钴、镍等靶材内部夹杂、分层、气泡、内裂等细小缺陷进行检测,可判断缺陷大小、位置和深度并形成报告.实验结果表明:该系统可以发现靶材内部当量直径0.3mm大小的缺陷,且具有较高的检测效率、稳定性和可靠性.
Abstract
In order to detect the defects such as oxide impurities,unsoldered and voids in the semiconductor target,and do not cause damage to the product in the testing process,an automatic detection system of semiconductor target using ultrasonic wave is proposed.The system adopts phased array probe for flooding detection,and the detection speed of X-axis and Y-axis in the three-axis moving system reaches 1000mm/s.It can detect small defects such as inclusions,delamination,bubbles and internal cracks in copper,aluminum,cobalt,nickel and other targets,judge the size,location and depth of defects and form a report.The experimental results show that the system can find the defects of the internal equivalent diameter 0.3mm of the target,and has high detection efficiency,stability and reliability.
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