Effect of Sputtering Process Time on the Sputtering Rate of Different Targets
In order to study the effect of sputtering process time on the sputtering rate of different target materials,copper,aluminum,silicon dioxide,and zinc oxide were selected as the research objects.The thickness of the deposited film is measured by sputtering at different process times.A mathematical model is established based on the thermal conductivity of the target material and the temperature changes inside the cavity during sputtering,and the relationship between the surface temperature of the target material and the sputtering process time is simulated by using MATLAB.Research shows that as the sputtering process time prolongs,the sputtering rate of metal targets such as copper and aluminum remains almost unchanged,while targets such as zinc oxide and silicon dioxide exhibit"sputtering weightlessness"phenomenon.The reason for this phenomenon is related to the thermal conductivity and bond energy of the target material.
magnetron sputteringsputtering ratesputtering weightlessnesssputtering process time
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