首页|Y3Si2C2掺量对Si3N4陶瓷微观结构与力/热学性能的影响

Y3Si2C2掺量对Si3N4陶瓷微观结构与力/热学性能的影响

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Si3N4陶瓷具有优异的力学、化学、热学性能,在电子元器件散热与封装领域具有良好的应用前景.为制备高强度、高导热的Si3N4陶瓷,采用Y3Si2C2-Mg0二元复合烧结助剂,系统研究了 Y3Si2C2掺量与保温时间对Si3N4陶瓷致密度、力学性能及热导率的影响规律,并基于微观结构和物相组成分析阐释了 Si3N4陶瓷力/热学性能的优化机制.研究结果表明:随着Y3Si2C2掺量的增加,Si3N4陶瓷试样(保温时间分别为4h和12h)的热导率和弯曲强度均呈现先增大后降低的变化规律;保温4 h所制Si3N4陶瓷的弯曲强度主要受致密度的影响,保温12h所制Si3N4陶瓷的弯曲强度主要受微观结构的均匀度及晶粒尺寸的影响;保温时间的延长有利于气体排出和晶粒生长,从而促进Si3N4陶瓷的致密化及热导率的提升.利用气压烧结(1900 ℃保温12 h),掺加1.5 mol%的Y3Si2C2可制得致密度为99.0%、热导率为(106.80±2.64)W·m-1·K-1、弯曲强度为(590.21±25.69)MPa的Si3N4陶瓷,其具有优良的力/热学综合性能,有利于提升Si3N4陶瓷封装电子元器件的服役安全性与可靠性.
Effects of Y3Si2C2 on Micro structure and Mechanical/Thermal Properties of Si3N4 Ceramics
Si3N4 ceramics have great application prospects in the fields of heat dissipation and packaging of electronic components,because of their excellent chemical stability,mechanical and thermal properties.In order to prepare Si3N4 ceramics with excellent bending strength and thermal conductivity,Y3Si2C2-MgO binary composite sintering additive was used in this work.The effects of Y3Si2C2 content and high temperature soaking time on relative density,mechanical properties and thermal conductivity of Si3N4 ceramics were systematically studied.The optimization mechanisms of mechanical/thermal properties of the Si3N4 ceramics were explained based on their microstructure and phase composition analyses.Thermal conductivity and bending strength of the Si3N4 ceramics,prepared after high temperature soaking for 4 h and 12 h,increased first and then decreased with increasing content of Y3Si2C2.The bending strength of the Si3N4 ceramics prepared by high temperature soaking for time for 4 h is mainly dependent on relative density,while that of the Si3N4 ceramics prepared by high temperature soaking for time for 12 h is related to the microstructure uniformity and Si3N4 grain size.The prolonging of holding time is conducive to eliminating pores and increasing grain size,resulting in enhanced densification and increased thermal conductivity.Si3N4 ceramics,with relative density of 99.0%,thermal conductivity of(106.80±2.64)W·m-1·K-1 and bending strength of(590.21±25.69)MPa,were prepared by using gas pressure sintering,at 1900 ℃ for 12 h,with the addition of 1.5 mol%Y3Si2C2.Such Si3N4 ceramics has excellent comprehensive mechanical/thermal properties,which is conducive to improving the service safety and reliability of Si3N4 ceramic packaged electronic components.

Si3N4 ceramicbinary composite sintering additiveY3Si2C2thermal conductivitymechanical propertymicrostructure

龙国钦、聂光临、陈炫志、黎业华、彭小晋、黄瑶、邓欣、伍尚华

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广东工业大学机电工程学院,广东广州 510006

蒙娜丽莎集团股份有限公司,广东佛山 528211

广东省大尺寸陶瓷薄板企业重点实验室,广东佛山 528211

广东金瓷三维技术有限公司,广东佛山 528225

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Si3N4陶瓷 二元复合烧结助剂 Y3Si2C2 热导率 力学性能 微观结构

广东省珠江人才计划本土创新科研团队项目广东省基础与应用基础研究基金广东省基础与应用基础研究基金广东省科技计划项目广东省重点领域研发计划佛山市科技创新团队项目

2017BT01C1692023A15150126762019B15151300052022B12120200012020B090923002FS0AA-KJ919-4402-002

2024

陶瓷学报
景德镇陶瓷学院

陶瓷学报

CSTPCD北大核心
影响因子:0.7
ISSN:1000-2278
年,卷(期):2024.45(3)
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