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有机模板孔径和烧结温度对SiC泡沫陶瓷结构和性能影响

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SiC泡沫陶瓷作为一种新型多孔材料,因其强度高、硬度高、耐腐蚀、耐高温等优异性能,被广泛应用于冶金、石油化工、航空航天、生物医学等领域.以SiC为主要原料,Al2O3为烧结助剂,采用有机模板浸渍法制备了 SiC泡沫陶瓷,研究了有机模板孔径和烧结温度对SiC泡沫陶瓷宏微观形貌、相组成、孔隙率及压缩性能的影响.结果表明:随着有机模板孔径由35 ppi增至20 ppi,SiC泡沫陶瓷的孔隙率由48.3%升至75.6%,而抗压强度由1.94 MPa降至0.40 MPa.随着烧结温度由1350 ℃提高至1500 ℃,SiC泡沫陶瓷的孔隙率由78.7%降至68.3%,抗压强度先升后降.在1450 ℃制备的SiC泡沫陶瓷样品抗压强度最高(1.45 MPa),其孔隙率为71.6%,孔结构完整、颗粒堆积紧密,针眼孔洞、裂纹以及脆性方石英相较少.
Effects of Organic Template Pore Size and Sintering Temperature on Structure and Properties of SiC Foam Ceramics
SiC foam ceramics,as a new type of porous materials,are widely used in metallurgy,petrochemical,aerospace,biomedicine and other fields due to its excellent properties of high strength,high hardness,corrosion resistance,and high temperature resistance.SiC foam ceramics were prepared by organic template impregnation with SiC as the main raw material and Al2O3 as the sintering aid.The effects of the organic template pore size and sintering temperature on macro and micro morphologies,phase composition,porosity and compression properties of the SiC foam ceramics were studied.Porosity of the SiC foam ceramics increased from 48.3%to 75.6%,as the pore size of the organic template increased from 35 ppi to 20 ppi,while the compressive strength decreased from 1.94 MPa to 0.4 MPa.As the sintering temperature was increased from 1350 ℃ to 1500 ℃,porosity of the SiC foam ceramics decreased from 78.7%to 68.3%,while the compressive strength first increased and then decreased.The SiC foam ceramic sample prepared at 1450 ℃ has the highest compressive strength(1.45 MPa)with a porosity of 71.6%.The pore structure is complete and particles are tightly packed.In addition,there are fewer pinholes,cracks and brittle phase cristobalite in the samples.

organic template impregnation methodSiCfoam ceramicscompression performance

张凤春、刘笑、陈桂锭、袁斌、刘宇杰、蒋维敏、韩强强、李旭勤

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成都工业学院材料与环境工程学院,四川成都 611730

有机模板浸渍法 SiC 泡沫陶瓷 压缩性能

四川省自然科学基金2022年国家级大学生创新创业训练计划项目成都工业学院2022年度校级科研项目

2022NSFSC03272022111160182022ZR003

2024

陶瓷学报
景德镇陶瓷学院

陶瓷学报

CSTPCD北大核心
影响因子:0.7
ISSN:1000-2278
年,卷(期):2024.45(3)
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