单磨头瓷砖抛光工艺参数对磨削均匀性的影响
Influence of Single Grinding Head Ceramic Tile Polishing Process Parameters on Grinding Uniformity
韩文 1杨振恒 1隋旭东 2徐磊 1曾时金 2于盛睿 1徐晗1
作者信息
- 1. 景德镇陶瓷大学,江西景德镇 333403
- 2. 科达制造股份有限公司,广东佛山 528313
- 折叠
摘要
针对瓷砖抛光生产中出现的过抛、漏抛等严重影响产品质量的问题,基于Preston方程和磨头外轮廓轨迹方程,建立了抛光工艺参数和运动参数与过抛、漏抛相关变量间的数学模型.仿真分析结果表明:过抛区域主要集中在抛光轨迹重叠区域,少部分分布在轨迹的上下弧形区域;当改变抛光工艺参数时,随着无漏抛区域宽度变大,重叠区域的面积也随之变大.通过调整抛光工艺参数不仅可在无漏抛区域宽度减少17.91％,还能使得重叠面积减少53.06％,极大改善了过抛情况,有效地提升了磨削均匀性,为后续实际生产中抛光轨迹的优化提供理论基础.
Abstract
This paper was aimed to address the serious issues of over-polishing and under-polishing in the production of ceramic tiles,which significantly affect product quality.Mathematical models were established to correlate polishing process parameters and motion parameters with variables related to over-polishing and under-polishing,based on the Preston equation and the grinding head outer profile trajectory equation.According to the simulation analysis results,it is revealed that over-polishing primarily occurs in the overlapping regions of the polishing trajectory,with a smaller proportion distributed in the upper and lower arc regions of the trajectory.As the polishing process parameters are modified,an increase in the width of the leak-free polishing zone corresponds to an enlargement of the overlapping area.It is possible to reduce the width of the leak-free polishing zone by 17.91％,simultaneously resulting in a 53.06％reduction in the overlapping area,by adjusting the polishing process parameters.This significant improvement effectively enhances the over-polishing situation,markedly promoting grinding uniformity.These findings offer a theoretical foundation for optimizing polishing trajectories in practical production of ceramic tiles.
关键词
均匀性/抛光工艺参数/磨削/Preston方程/仿真分析Key words
uniformity/polishing process parameters/grinding/Preston equation/simulation analysis引用本文复制引用
基金项目
景德镇市陶瓷产业重大产学研协同攻关和成果转化项目(2023ZDGC003)
校企合作项目(KD-XMLX-20231244)
出版年
2024
国家科技期刊平台
NSTL
万方数据