Influence of Single Grinding Head Ceramic Tile Polishing Process Parameters on Grinding Uniformity
This paper was aimed to address the serious issues of over-polishing and under-polishing in the production of ceramic tiles,which significantly affect product quality.Mathematical models were established to correlate polishing process parameters and motion parameters with variables related to over-polishing and under-polishing,based on the Preston equation and the grinding head outer profile trajectory equation.According to the simulation analysis results,it is revealed that over-polishing primarily occurs in the overlapping regions of the polishing trajectory,with a smaller proportion distributed in the upper and lower arc regions of the trajectory.As the polishing process parameters are modified,an increase in the width of the leak-free polishing zone corresponds to an enlargement of the overlapping area.It is possible to reduce the width of the leak-free polishing zone by 17.91％,simultaneously resulting in a 53.06％reduction in the overlapping area,by adjusting the polishing process parameters.This significant improvement effectively enhances the over-polishing situation,markedly promoting grinding uniformity.These findings offer a theoretical foundation for optimizing polishing trajectories in practical production of ceramic tiles.
uniformitypolishing process parametersgrindingPreston equationsimulation analysis
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