Random Vibration Failure Analysis and Antivibration Optimization of Metal Encapsulated Shell
During the operation of a hybrid integrated circuit(HIC),cracks easily develop in the inner area of the joint on the long side of the shell due to random vibration,leading to failure.To resolve this problem,this study investigated the vibration-related failure phenomenon.The simulation software ABAQUS was used to conduct modal and random vibration experiments and simulations on a large-sized HIC package shell to determine the weak positions on the surface of the device,that is,positions with the potential to develop cracks.The dangerous position and reso-nance frequency of the cover plate of the shell under random excitation were determined by combining finite element simulation and testing.Sinusoidal vibration experiments under different loads were designed to assess weak positions,and S-N curves of materials were obtained by combining vibration experiments with simulation.The study results showed that the cause of failure due to the dangerous position was the vibration fatigue failure caused by the stress concentration phenomenon of random vibration;consequently,a scheme to reduce vibration was designed to optimize the structure of the original module according to the failure cause;additionally,the vibration reduction and reinforcement of the dangerous position were implemented to improve the antivibration performance of the device.
hybrid integrated circuit(HIC)random vibrationstructure optimizationfinite element analysis
万方数据
维普
