LED封装用高折光有机硅树脂的制备及性能研究

Preparation and Performance Study of High Refractive Index Silicone Resin for LED Encapsulation

孙文琪 ¹安秋凤 ¹焦岚姣 ¹王召帅¹

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作者信息

1. 陕西科技大学陕西省轻化工助剂重点实验室,西安 710021
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摘要

通过水解缩聚法,以二苯基二甲氧基硅氧烷(DMDPS)、甲基苯基二甲氧基硅烷(MPDMS)、1,3,5,7-四甲基环四硅氧烷(D4H)、四甲基二硅氧烷(D2H)、1,3,5,7-四甲基-1,3,5,7-四乙烯基环四硅氧烷(D4Vi)和二乙烯基四甲基二硅氧烷(D2Vi)为原料,制备了含氢苯基硅树脂(HPS)和乙烯基苯基硅树脂(VPS).将二者进行复配,并经高温固化后得到封装材料VHPMS.探讨不同复配比例对封装材料透光性、热稳定性、拉伸强度、耐老化性和疏水性的影响.结果表明:当含氢苯基硅树脂与乙烯基苯基硅树脂的质量比为3∶5时,制得的VHPMS整体性能最优.其在可见光范围的透光率大于98％,折光指数可达1.543 6,邵A硬度为84且疏水角为121°,热稳定好,黏附性强,经红墨水渗透实验和耐老化测试前后基本无变化.

Abstract

Hydrogen phenyl silicone resin(HPS)and vinyl phenyl silicone resin(VPS)were prepared through hydrolytic polycondensation method,using diphenyl-dimethoxy-siloxane(DMDPS),methyl-phenyl-dimethoxy-silane(MPDMS),1,3,5,7-tetramethylcyclote-trasiloxane(D4H),tetramethyl-disiloxane(D2H),1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane cyclotetrasiloxane(D4Vi)and divinyl-tetramethyl-disiloxane(D2Vi)as raw materials.The two components were compounded and the packaging material VHPMS was obtained after high-temperature cured.The influence of different compounding ratios on the light transmittance,thermal stability,tensile strength,aging resistance and hydrophobicity of the packaging material was discussed.The results showed that the mass ratio of hydrogen phenyl silicone resin to vinyl phenyl silicone resin was 3∶5.The VHPMS showed excellent overall performance.Its refractive index was 1.543 6,the light transmittance reached 98％,the shore hardness was 84 and the hydrophobic angle was 121°.There was basically no change in performance before and after the red ink penetration experiment and aging resistance test.

关键词

LED封装/含氢苯基硅树脂/水解缩合/硅氢加成

Key words

LED packaging/phenyl silicone resins/hydrolysis conde-nsation/silicon hydroxide addition

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出版年

2025

涂料工业

中海油常州涂料化工研究院中国化工学会涂料涂装专业委员会

涂料工业

北大核心

影响因子：0.66

ISSN：0253-4312

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