多芯片高精度固晶设备控制系统设计
Design of Control System for Multi-chip High-precision Die-bonding Equipment
马轶博 1丁宇心 1段晋胜1
作者信息
- 1. 中国电子科技集团公司第二研究所,山西 太原 030024
- 折叠
摘要
本文指出固晶是集成电路半导体后道封装工艺中的重要环节,作为该工艺的实现设备,高精度固晶机对半导体后道封装产品的良品率起着至关重要的作用.国内现有高精度固晶机多为进口设备,存在交货周期长、售后服务不到位且存在随时对中国禁运的风险,针对以上问题,中国电子科技集团公司第二研究所自主研制的多芯片高精度固晶机,实现了高精度固晶贴片设备的自主可控.本文重点阐述多芯片高精度固晶机的控制系统设计.
Abstract
This paper points out that die-bonding is an important link in the back-channel packaging process of integrated circuit semiconductor.As the realization equipment of this process,high-precision die-bonding machine plays a crucial role in the yield of semiconductor back-channel packaging products.Most of the existing high-precision die-bonding machines in China are imported equipment,and there is a long delivery cycle,after-sales service is not in place and there is the risk of embargo to China at any time.In response to the above problems,The 2nd Research Institute of CETC independently developed a multi-chip high-precision die-bonding machine to achieve the autonomy and control of high-precision die-bonding chip equipment.This paper focuses on the control system design of multi-chip high-precision die-bonding machine.
关键词
多芯片/高精度/固晶/运动控制器/上位机Key words
multi-chip/high-precision/die-bonding/motion controller/upper computer引用本文复制引用
出版年
2024
NETL
NSTL
万方数据