Design of Control System for Multi-chip High-precision Die-bonding Equipment
This paper points out that die-bonding is an important link in the back-channel packaging process of integrated circuit semiconductor.As the realization equipment of this process,high-precision die-bonding machine plays a crucial role in the yield of semiconductor back-channel packaging products.Most of the existing high-precision die-bonding machines in China are imported equipment,and there is a long delivery cycle,after-sales service is not in place and there is the risk of embargo to China at any time.In response to the above problems,The 2nd Research Institute of CETC independently developed a multi-chip high-precision die-bonding machine to achieve the autonomy and control of high-precision die-bonding chip equipment.This paper focuses on the control system design of multi-chip high-precision die-bonding machine.
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