基于双分支Cauer模型的IGBT模块焊料层老化监测方法
AGING MONITORING METHOD OF SOLDER LAYER OF IGBT MODULE BASED ON DUAL-BRANCH CAUER MODEL
刘雪庭 1杜明星 1马格 1尹艺迪1
作者信息
- 1. 天津市新能源电力变换传输与智能控制重点实验室(天津理工大学),天津 300384
- 折叠
摘要
以绝缘栅双极型晶体管(IGBT)的焊料层为研究对象,在传统Cauer模型的基础上,提出考虑芯片-铜端子热流支路的双分支Cauer模型,利用光纤温度传感器测量裸露在IGBT模块外部的铜端子温度和IGBT模块底板温度,以获取IGBT芯片结温,通过分析芯片结温、铜端子温度、底板温度的变化规律,准确定位焊料层老化位置,以区分芯片焊料层老化和底板焊料层老化,从而实现对不同焊料层的老化状态监测.
Abstract
The solder layer of insulated gate bipolar junction transistor(IGBT)is selected as the research object.Based on the traditional Cauer model,the dual-branch Cauer model considering chip-copper terminal heat flow branch was proposed.The temperature of copper terminal exposed outside the IGBT module and the temperature of IGBT module baseplate were measured by optical fiber temperature sensor to obtain the IGBT chip junction temperature.By analyzing the changes of chip junction temperature,copper terminal temperature and baseplate temperature,the aging position of the solder layer is accurately located,the chip solder layer aging and baseplate solder layer aging is effectively distinguished.
关键词
绝缘栅双极型晶体管/状态监测/有限元分析/焊料层老化/Cauer热网络模型Key words
insulated gate bipolar transistor/condition monitoring/finite element analysis/solder layer aging/Cauer thermal network model引用本文复制引用
基金项目
天津市技术创新引导专项(基金)(20YDTPJC00510)
出版年
2024
NETL
NSTL
维普
万方数据