JUNCTION TEMPERATURE PREDICTION OF IGBT MODULE IN INVERTER BASED ON IMPROVED TWO-BRANCH COUPLING CAUER MODEL
Under severe operating conditions,IGBT modules used in inverters for photovoltaic and wind power systems are highly susceptible to aging,which leads to the formation of voids in the solder layer,and the thermo-physical properties of the chip material alsomay change due to high temperatures,and the combination of the two factors will significantly affect the prediction accuracy of the coupling model.Based on this,the influence of solder layer voids and chip thermal effects on chip junction temperature are analyzed under the thermal coupling effect,and an improved double-branch coupling Cauer model that simultaneously considers the damage of solder layer voids and the thermal effects of chip materials in the IGBT chip is established.The effects of different voiding rates on the thermal characteristics of IGBT modules are investigated by the finite element method,and the calculation method of the thermal resistance of the solder layer when containing voids is given.On this basis,the dependence of the thermal parameters of the chip of the IGBT module on the temperature is further considered,and the function model of the chip thermal resistance-temperature is established.Ultimately,the accuracy and validity of the proposed improved model is experimentally verified,which improves the junction temperature prediction accuracy of IGBT modules and enhances the reliability of inverters in photovoltaic and wind power systems.
inverterIGBT modulejunction temperaturethermophysical propertiessolder layer voidsCauer thermal network model
万方数据
维普
