用于木质素解聚的半导体光催化研究
STUDY ON SEMICONDUCTOR PHOTOCATALYSIS FOR LIGNIN DEPOLYMERIZATION
陆佳 1苏小红 1王欣 1尤宏梅 1刘伟1
作者信息
- 1. 黑龙江省能源环境研究院,哈尔滨 150027
- 折叠
摘要
在温和条件下光催化木质素解聚可获得芳香族化合物,基于木质素的结构,综述国内外半导体光催化木质素中C—O、C—C键断裂机制,以及掺杂、贵金属沉积、构建复合材料等提升光催化剂稳定性及解聚木质素效率的改性方法;总结光催化在处理天然木质纤维素原料中的应用,外加场耦合强化光催化降解木质素策略,最后对半导体光催化木质素解聚方面未来研究重点和发展前景进行展望,以期推动光催化木质素解聚技术创新与工业化进程.
Abstract
Aromatic compounds can be obtained from lignin depolymerization by photocatalysis under mild conditions.Based on the structure of lignin,the C—O and C—C fracture mechanisms in lignin photocatalytic catalyzed by semiconductor,semiconductor modification methods such as doping,precious metal deposition,and construction of composite materials,which can improve photocatalyst stability and lignin depolymerization efficiency,are reviewed in this paper.The application of photocatalysis in the treatment of natural lignocellulosic raw materials,and the strategy of lignin degradation by external-field-coupled photocatalysis are summarized.Finally,the future research focus and development prospects of semiconductor in photocatalytic lignin depolymerization are prospected,which aimed to promote the technological innovation and industrialization of photocatalytic lignin depolymerization.
关键词
木质素/光催化/半导体/解聚机理/改性/外加场Key words
lignin/photocatalysis/semiconductor/depolymerization mechanism/modification/external-field引用本文复制引用
出版年
2024
NETL
NSTL
万方数据