Preparation of Gradient High-silicon Aluminum Alloy by Diffusion Welding and Numerical Simulation of Thermal Stress
Effects of hot-pressing temperature on interlayer width of gradient high-silicon aluminum alloy were investi-gated,and the thermal stress distribution in gradient high-silicon aluminum alloy as well as effects of interlayer width on thermal stress were conducted by finite element simulation.The results indicate that as temperature rises,the inter-layer undergoes transformation from a clear interface to a fuzzy interface,and finally vanishes,which promote the diffu-sion of silicon at the boundary.According to the simulation results,the average thermal stress of Si/Al alloy is increased with the interlayer width.The average thermal stress of Al matrix phase is greater than that of Si matrix phase,while the extreme value of stress mainly appears in the silicon phase.
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