扩散焊制备梯度高硅铝合金以及热应力的数值模拟
Preparation of Gradient High-silicon Aluminum Alloy by Diffusion Welding and Numerical Simulation of Thermal Stress
石林 1王延绅 2周灿旭 3金云学 4刘源3
作者信息
- 1. 江苏科技大学材料科学与工程学院,镇江 212000;清华大学材料学院,北京 100084
- 2. 清华大学材料学院,北京 100084
- 3. 清华大学材料学院,北京 100084;清华大学先进成形制造教育部重点实验室,北京 100084
- 4. 江苏科技大学材料科学与工程学院,镇江 212000
- 折叠
摘要
研究了热压温度对梯度高硅铝合金中间层宽度的影响,并通过有限元模拟研究了不同参数下梯度高硅铝合金组织中的热应力分布以及中间层宽度对热应力的影响.结果表明,随着温度升高,中间层会出现从界面分明到界面层模糊再到中间层消失的过程,且中间层的存在促进了Si在焊缝附近的扩散.模拟结果表明,中间层宽度越宽,高硅铝合金整体的平均热应力越大.虽然Al基体的平均热应力大于Si相的,但是应力极值主要出现在Si相中.
Abstract
Effects of hot-pressing temperature on interlayer width of gradient high-silicon aluminum alloy were investi-gated,and the thermal stress distribution in gradient high-silicon aluminum alloy as well as effects of interlayer width on thermal stress were conducted by finite element simulation.The results indicate that as temperature rises,the inter-layer undergoes transformation from a clear interface to a fuzzy interface,and finally vanishes,which promote the diffu-sion of silicon at the boundary.According to the simulation results,the average thermal stress of Si/Al alloy is increased with the interlayer width.The average thermal stress of Al matrix phase is greater than that of Si matrix phase,while the extreme value of stress mainly appears in the silicon phase.
关键词
数值模拟/高硅铝合金/梯度结构/热应力Key words
Numerical Simulation/High-silicon Aluminum Alloy/Gradient Structure/Thermal Stress引用本文复制引用
出版年
2024
NETL
NSTL
维普
万方数据