Microstructure and Mechanical Properties of SPS Diffusion-bonded Interface of Dia-mond/Cu Composites
SPS diffusion bonding tests were carried out on the diamond/copper composite,and the interface diffusion analysis and shear performance test were conducted on the joints.The effects of SPS diffusion bonding process param-eters on the microstructure and mechanical properties of the bonding interface were investigated.The results indicate that with the increase of bonding temperature and sintering time,the defects such as holes and voids in the diffusion interface area of diamond/copper joint are decreased,and the element diffusion is sufficient with tungsten gradually dif-fusing to the copper direction,and the W2C phase and W phase in the bonded interface are reduced compared with the base metal.With the improvement of diffusion bonding quality,the thermal conductivity,maximum shear force and shear strength of bonded joints are increased,and a large number of cleavage planes and fracture steps are gradually generated on the shear section,accompanied with a small number of tear edges.The fracture mechanism is trans-formed from brittle fracture to semi-cleavage ductile fracture.When the diffusion temperature is 750℃ and the sinter-ing time is 90 min,the bonding interface presents a satisfied element diffusion effect and maintains a high thermal con-ductivity[347.73 W/(m∙K)],where the maximum shear strength reaches 48.83 MPa.
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维普
