In对Sn-Cu-Ni焊料的润湿性、界面组织及性能的影响
Effects of In on Wettability,Interfacial Structure and Properties of Sn-Cu-Ni Solder
王新宝 1刘亚 1郭志球 2陈军修 1王建华 1苏旭平1
作者信息
- 1. 常州大学江苏省材料表面科学与技术重点实验室,常州 213164
- 2. 浙江晶科能源有限公司,嘉兴 314416
- 折叠
摘要
在Sn-0.7Cu-0.1Ni焊料中添加不同含量的In,研究了In加入量对焊料合金微观组织、熔化性能、力学性能、润湿性能及界面反应的影响.结果发现,随着In加入量增加,焊料合金的熔点降低,抗拉强度增大,显微硬度变小,润湿性得到优化.同时,焊料合金与Cu基体的界面组织中(Cu,Ni)6Sn5相层有增厚的趋势.
Abstract
Different contents of In were added to Sn-0.7Cu-0.1Ni solder,and the effects of In content on microstruc-ture,melting behavior,mechanical property,wetting property and interfacial reaction of the solder alloy were investi-gated.The results indicate that with the increase of In content,the melting point and microhardness of the solder alloy are decreased,meanwhile the tensile strength is increased,so the wettability is optimized.Meanwhile,the(Cu,Ni)6Sn5 phase layer tends to be thickened.
关键词
Sn-Cu-Ni-In合金/熔化性能/力学性能/润湿性/界面反应Key words
Sn-Cu-Ni-In Alloy/Melting Behavior/Mechanical Property/Wettability/Interfacial Reaction引用本文复制引用
基金项目
国家自然科学基金资助项目(52271005)
海宁市协同创新资助项目(20220104)
出版年
2024
NETL
NSTL
万方数据