多组元Sn基高温软钎料的组织形成规律及性能研究
Microstructure Formation Law and Properties of Multi-component Sn-based High-temperature Solder
樊江磊 1王娇娇 1王宁格 1吴深 1周向葵 1李莹 1王艳1
作者信息
- 1. 郑州轻工业大学机电工程学院,郑州 450002
- 折叠
摘要
以Sn元素为基础合金,通过与不同金属元素合金化,熔炼制备了多元Sn基钎料合金,研究了Sn-Cu-Ni-Sb-Bi系钎料合金的组织和性能随混合熵值变化的规律.结果表明,钎料合金的微观组织是由固溶体和析出相Cu3Sn相、Ni3Sn4相和Sn-Sb相组成,随着混合熵值增大,钎料合金组织中的固溶体含量逐渐提高,Sn基体含量逐渐降低,且硬度逐渐增大,硬度(HV0.5)最大为287,硬度(HB)最大为81.8.抗拉强度先增大后减小,且在中熵成分时最大,为65.6 MPa.耐腐蚀性能呈现出逐渐增强的趋势.钎料合金的熔点为141～251℃,电阻率范围为0.101～0.87 μΩ·m.综合分析得出,Sn20Cu20Ni20Sb20Bi20钎料合金适合作为高温无铅软钎料使用.
Abstract
Taking Sn as base alloy,a multi-component Sn-based solder alloy was melted and alloyed with different ele-ments,and the variation law of microstructure and properties of Sn-Cu-Ni-Sb-Bi alloy with mixing entropy was inves-tigated.The results reveal that the microstructure of solder alloy is composed of solid solution and precipitated Cu3Sn,Ni3Sn4 and Sn-Sb phase.With the increase of mixing entropy value,the solid solution content in solder alloy is gradu-ally increased,and Sn matrix content is gradually decreased,with the increase of hardness,which reaches the maxi-mum of 287 HV0.5 and 81.8 HB.The tensile strength is firstly increased and then decreased,reaching the maximum of 65.6 MPa at medium entropy composition,and the corrosion resistance presents a trend of gradual enhancement.The melting point range of solder alloys is 141～251℃,and the resistivity is ranged from 0.101 to 0.87 μΩ·m,indicating that the high-entropy composition of Sn20Cu20Ni20Sb20Bi20 solder alloy is suitable for using as high-temperature lead-free soft solder.
关键词
无铅钎料/高熵合金/微观组织/力学性能Key words
Lead-free Solder/High Entropy Alloy/Microstructure/Mechanical Properties引用本文复制引用
基金项目
河南省自然科学基金(222300420584)
出版年
2024
NETL
NSTL
万方数据