Microstructure Formation Law and Properties of Multi-component Sn-based High-temperature Solder
Taking Sn as base alloy,a multi-component Sn-based solder alloy was melted and alloyed with different ele-ments,and the variation law of microstructure and properties of Sn-Cu-Ni-Sb-Bi alloy with mixing entropy was inves-tigated.The results reveal that the microstructure of solder alloy is composed of solid solution and precipitated Cu3Sn,Ni3Sn4 and Sn-Sb phase.With the increase of mixing entropy value,the solid solution content in solder alloy is gradu-ally increased,and Sn matrix content is gradually decreased,with the increase of hardness,which reaches the maxi-mum of 287 HV0.5 and 81.8 HB.The tensile strength is firstly increased and then decreased,reaching the maximum of 65.6 MPa at medium entropy composition,and the corrosion resistance presents a trend of gradual enhancement.The melting point range of solder alloys is 141～251℃,and the resistivity is ranged from 0.101 to 0.87 μΩ·m,indicating that the high-entropy composition of Sn20Cu20Ni20Sb20Bi20 solder alloy is suitable for using as high-temperature lead-free soft solder.
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