首页|AlN/ZC55镁基复合材料的制备及其热物性能研究

AlN/ZC55镁基复合材料的制备及其热物性能研究

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镁基封装材料具有低密度、高电磁屏蔽性的优点,但过高的热膨胀系数限制了其使用.AlN是一种新型的基板材料,其具有高于镁合金的热导率与低于镁合金的热膨胀系数,可作为强化相改善镁合金的热物性能.本研究通过搅拌铸造法制备了AlN/ZC55复合材料,探究了AlN含量对于复合材料热物性能的影响.结果表明,AlN可以显著降低复合材料的热膨胀系数,同时小幅削弱复合材料的散热性能.当添加质量分数为20%的AlN时,复合材料的热导率为126.2 W/(m·K),热膨胀系数仅有19.83×10-6 K-1.
Preparation and Thermophysical Properties of AlN/ZC55 Mg Matrix Composites
Mg matrix encapsulation materials possess the advantage of low density and high electromagnetic shielding,while the excessively high coefficient of thermal expansion limits their usage.As a new type of substrate material,AlN exhibits a higher thermal conductivity and a lower coefficient of thermal expansion(CTE)than those of magnesium alloys,which can be used as a reinforcement phase to improve the thermophysical properties of magnesium alloy.AlN/ZC55 composites were prepared by stirring casting method,and the influence of AlN content on thermophysical proper-ties of composites was explored.The results indicate that AlN particles can significantly reduce the CTE and slightly weaken the heat dissipation performance of composite.With 20%of AlN particles addition,the thermal conductivity reaches 126.2 W/(m·K)while CTE is 1.983×10-5 K-1.

Magnesium Matrix CompositesThermal ConductivityCoefficient of Thermal ExpansionAlN

陈露、郭光辉、李建宇、吕书林、郭威、吴树森

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华中科技大学材料科学与工程学院,材料成形与模具技术全国重点实验室,武汉 430074

镁基复合材料 热导率 热膨胀系数 AlN

国家自然科学基金资助项目

52175321

2024

特种铸造及有色合金
中国机械工程学会铸造分会

特种铸造及有色合金

CSTPCD北大核心
影响因子:0.481
ISSN:1001-2249
年,卷(期):2024.44(9)