In order to meet the miniaturization requirements of embedded computer development in the future,the key technology of electronic system miniaturization,SiP,is explored,and the design process of a dual-core heterogeneous SiP product based on ARM+FPGA is introduced.The SiP product consists of FPGA bare core,MCU bare core based on ARM Cortex-M4,flash bare core,level shifting bare core,RS422 transceiver bare core and several resistance-capacitance discrete devices.All bare cores are integrated into a module with the substrate as the carrier through advanced packaging technology,so as to save the printed circuit board area and reduce the cost,help to reduce the design difficulty of hardware engineers,and realize the miniaturization and high integration of embedded boards.The package structure of SiP module adopts PBGA package,with four-layer BT substrate as the carrier and plastic packaging technology,which greatly reduces the module size.
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