Study on the Influence of Die Bonding Solder Secondary Flow on the Reliability of Aluminum-Silicon Wire Bonding Substrate
Based on the failure phenomenon found in the in-line inspection of a device,an experi-mental study was carried out.Aiming at the problem that the aluminum-silicon wire can't be directly bonded to the chip mounting material,the remelting phenomenon of the die bonding solder in the process of sealing the cap is analyzed,the storage test at 300℃ for 24h and the life test at 125℃ for 168h are carried out to test the bonding tension and breakpoint position.After the test,the bonding tension meets the requirements of the national military standard,and the fracture position does not appear at the Au-Al bonding interface,which can effectively explain the influence of the secondary flow of the die solder on the reliability of the aluminum wire bonding substrate and avoid the recurrence of the problem.
Solder remeltingBonding reliabilityStorage life testingAccelerated life testing
万方数据
维普
