CQFP器件引线成型方法及板级可靠性研究
Research on Lead Forming Method and Board-Level Reliability of CQFP Device
李雪冰 1江山 1刘卫丽1
作者信息
- 1. 重庆吉芯科技有限公司,重庆 401332
- 折叠
摘要
针对早期定型的CQFP器件在设计时并未考虑到板级安装可靠性,存在引线与瓷体共面度差异大、引线应力释放效果不明显等问题,以CQFP128器件为例,进行引线成型设计和板级可靠性验证的研究.研究对CQFP材料结构、出线方式及引线成型要求展开详细分析,并通过试验证明成型后的器件具备更好的焊接共面性;在经历整机振动试验后,通过X射线、扫描电镜等分析方法,表征出焊点具备良好的可靠性.本研究可为同类型器件引线成型和可靠性验证提供参考.
Abstract
In view of the problems that the reliability of board-level installation is not considered in the design of CQFP devices in the early stage,such as the large coplanarity difference between leads and porcelain,and the insignificant stress release effect of leads,taking CQFP128 devices as an example,the lead molding design and board-level reliability verification are studied.The material structure,wiring mode and lead forming requirements of CQFP are analyzed in detail,and it is proved by experiments that the formed device has better welding coplanarity.After the vibration test of the whole machine,the reliability of the solder joint is characterized by X-ray,scanning electron microscope and other analysis methods.The study can provide reference for lead forming and reliability verification of similar devices.
关键词
CQFP封装/封装结构/引线成型/板级可靠性Key words
CQFP/Package structure/Lead forming/Board level reliability引用本文复制引用
出版年
2024
NETL
NSTL
万方数据