Research on Lead Forming Method and Board-Level Reliability of CQFP Device
In view of the problems that the reliability of board-level installation is not considered in the design of CQFP devices in the early stage,such as the large coplanarity difference between leads and porcelain,and the insignificant stress release effect of leads,taking CQFP128 devices as an example,the lead molding design and board-level reliability verification are studied.The material structure,wiring mode and lead forming requirements of CQFP are analyzed in detail,and it is proved by experiments that the formed device has better welding coplanarity.After the vibration test of the whole machine,the reliability of the solder joint is characterized by X-ray,scanning electron microscope and other analysis methods.The study can provide reference for lead forming and reliability verification of similar devices.
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