Simulation Analysis of Thermal Deformation in Plastic-Encapsulated BGA Based on Abaqus
Addressing the issue of warpage deformation in plastic-encapsulated BGA chips during the soldering process due to differences in component sizes and material parameters,the finite element analysis software Abaqus is used to model a specific plastic-encapsulated BGA and simulate its deforma-tion during soldering.The study calculates and analyzes the effects of three types of encapsulation materials and different thicknesses of substrates and encapsulation materials on chip deformation during solder joint solidification.The analysis results show that the calculated deformation values of the chip are close to the measured values using Shadow Moiré,further revealing the influence of the matching degree between the thermal expansion coefficients of the encapsulation material and the substrate,as well as the thickness of the substrate and encapsulation material within a certain range,on the chip deformation.The conclusions help to optimize the adjustment of material selection and dimensional ratios,improving the chip's thermal deformation resistance at the design stage.
Chip deformationAbaqusCoefficient of thermal expansionSubstrateEncapsulation materials
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