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一种p-GaN HEMTs栅电荷表征方法

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与Si基金属-氧化物-半导体场效应晶体管(MOSFETs)的绝缘栅结构不同,p-GaN增强型高电子迁移率晶体管(HEMTs)的栅极结构为pn结,其在较大正向电压下处于导通状态,漏电导较大.传统栅电荷测试方法假设栅极注入电流全部存储为栅电荷,因此不适用于p-GaN HEMTs器件,否则会严重高估数值.鉴于此,基于栅电荷积累的基本过程,提出了利用动态电容法来减小漏电流影响来提取p-GaN E-HEMT的栅电荷参数.结果表明,该方法能够得到更理想的栅电荷米勒平台和特性曲线,结果更符合实际,具有重要的应用价值.
Gate Charge Characterization Method for p-GaN HEMTs
Unlike the insulated gate structure of the Si-based metal-oxide-semiconductor field-effect transistors(MOSFETs),the gate of p-GaN-enhanced high electron mobility transistors(HEMTs)is a p-n junction,which is highly conductive under a large forward bias condition.The traditional method for the gate charge assumes that all current is injected and stored as gate charge.Thus,it is not applicable to p-GaN HEMT devices because the parameter values would be significantly overestimated.In this study,based on the basic accumulation process of the gate charge,we propose a dynamic capacitance method to extract the gate charge parameters of p-GaN E-HEMTs,which can reduce the impact of the forward leakage current.The capacitance method produces an ideal Miller plateau and characteristic curve,indicating significant potential for practical application.

p-GaN HEMTsgate chargecurrent methodcapacitance method

刘震、潘效飞、龚平、王燕平、叶斯灿、卢澳、闫大为

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江南大学电子工程系物联网技术应用教育部工程研究中心,江苏无锡 214122

无锡华润安盛科技有限公司,江苏无锡 214000

无锡芯鉴半导体技术有限公司,江苏无锡 214000

p-GaN HEMTs 栅电荷 电流法 电容法

江苏省研究生科研与实践创新计划

KYCX18_1855

2024

微电子学
四川固体电路研究所

微电子学

CSTPCD北大核心
影响因子:0.274
ISSN:1004-3365
年,卷(期):2024.54(2)
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