建立了 3D封装玻璃通孔(TGV)电磁仿真分析模型,对TGV高频信号特性进行了分析,得到了回波损耗S11仿真结果,并研究了信号频率、通孔类型、通孔最大直径、通孔高度、通孔最小直径对S11的影响.选取TGV关键结构通孔最大直径、通孔高度、通孔最小直径尺寸为设计参数,以TGV在信号频率10 GHz下的S11作为目标值,采用响应曲面法,设计17组试验进行仿真,并拟合了 TGV S11与其关键结构参数的关系模型.结合遗传算法对拟合模型进行优化,得到TGV S11最优的组合参数:通孔最大直径65μm、通孔高度360μm、通孔最小直径尺寸44μm.对最优组合参数进行验证,发现最优参数组合仿真结果较基本模型S11减小了 1.593 5 dB,实现了TGV的结构优化.
High-Frequency Characteristic Analysis and Optimization of 3D-Packaging Through Glass Via
A simulation analysis model of a 3D-packaging through glass via(TGV)was established.The high-frequency signal characteristics of TGV were analyzed,and the simulation results of the return loss(S11)were obtained.The influences of the signal frequency,type,maximum diameter,height,and minimum diameter of the TGV on the S11 were studied.The maximum diameter,height,and minimum diameter of the TGV were selected as the design parameters,and the Si1 at 10 GHz was obtained as the target value.Seventeen groups of experimental simulation calculations were designed using the response surface method,and the relationship between the S11 of the TGV and its key structural parameters was fitted.The fitting model was optimized by combining a genetic algorithm,and the optimal combination parameters of the TGV S11 were obtained as follows:a maximum diameter of 65 μm,height of 360 µm,and minimum diameter of 44 μm.The optimal combination parameters were verified.The simulation results of the optimal combination parameters are 1.593 5 dB less than the S11 of the basic model,and the structure of the TGV is optimized.
through glass viahigh-frequency signal characteristicsreturn lossstructural optimization
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