首页|小型化高隔离度射频滤波模组设计研究

小型化高隔离度射频滤波模组设计研究

扫码查看
围绕射频滤波模组设计开展研究,针对模组小型化高集成度设计中的射频信号传输及隔离问题,进行了内部关键电路结构的精细化三维电磁场建模仿真分析,以提高模型的准确度.通过关键结构制作及去嵌测试,验证了仿真设计的准确性.并加工了一款尺寸为14.97 mm× 12.01 mm×1.29 mm的L波段射频滤波模组,该滤波模组集成滤波器数量为16个,插入损耗≤5.20 dB,带外抑制≥42.5 dB.
A High-Speed and Low-Voltage Differential Signaling Driver
This paper focuses on the design of RF filtering front-end module.In view of the RF signal transmission and isolation problems involved in the miniaturized and highly integrated design of the module,a refined three-dimensional electromagnetic field modeling simulation analysis is carried out to improve the model accuracy.In order to verify the simulation design accuracy,the key structural model are fabricated and de-embedding tested.And an L-band miniaturized RF filtering front-end module has been fabricated.The module size is 14.97 mm×12.01 mm×1.29 mm.The number of the integrated filters is 16.The insertion loss is ≤5.2 dB,and the out-of-band rejection is ≥42.5 dB.

RF filtering moduleisolationde-embedding testout-of-band rejection

彭佳红、王玺、谭玉婷、陈焱杰、余怀强

展开 >

中国电子科技集团公司第二十六研究所,重庆 400060

射频滤波模组 隔离度 去嵌测试 带外抑制

2024

微电子学
四川固体电路研究所

微电子学

CSTPCD北大核心
影响因子:0.274
ISSN:1004-3365
年,卷(期):2024.54(2)
  • 5