Research Progress of Cu Bonding Wires for Microelectronics Packaging
Wire bonding is still the most popular chip interconnection technology in microelectronic packaging and will not be replaced by other interconnection methods for a long time in the future.Au bonding wire has been a mainstream semiconductor packaging material for decades owing to its unique chemical stability,reliable manufacturing,and operational properties.However,the steep increase in the price of Au bonding wires has prompted the industry to seek alternative bonding materials for microelectronics packaging,such as Cu bonding wires.The main advantages of using Cu bonding wires over Au bonding wires are lower cost,higher electrical and thermal conductivity enabling smaller-diameter Cu bonding wires to conduct the same current as Au bonding wires without overheating,and lower reaction rates between Cu and Al,which improve the bonding reliability under long-term high-temperature storage conditions.This study briefly introduces the development history of bonding wires.Moreover,the manufacturability and reliability of Cu bonding wires are discussed.Finally,the trend of bonding wire development is presented.
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