Glass Cracking and Process Optimization of Ultra-high-voltage Glass-sealed Diodes
Aiming at the glass cracking in ultra-high-voltage sealed diodes under environmental stress and combining the material characteristics of glass powder,experiments were conducted on specific types of glass powder using different sintering curves.The glass transition and crystallization temperature characteristics of glass powder were studied.Through experiments using different sintering curves for specific types of glass powder,the toughness of the glass was improved by increasing the sintering time in the constant temperature zone and reducing the cooling rate.A significant reduction in sand holes and bubbles in the glass was obtained through secondary grinding on the selected model of glass powder.The ultra-high-voltage sealed diode samples produced using the above process passed environmental stress tests such as high temperature storage and high/low temperature impacts.
ultra-high voltage diodeglass sinteringglass crackingglass passivation
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