3D IC器件通过三维堆叠技术显著提升了系统的集成度,增加了系统的功率密度,同时也带来了显著的热管理挑战.为了更好地对3D IC器件进行热分析,对3D IC进行结构建模,通过热路分析的方法对最高层芯片温度进行了估计,在此基础上考虑TSV结构及不同TSV截面面积对芯片有源层温度的影响.最后,综合3D IC结构特征和热特性分析方法,基于MATLAB编写了3D IC的温度预测软件,并将该软件与商业COMSOL软件精度和效率对比,该软件优势在于,在满足一定的温度预测精度条件下,支持用户自定义3D IC的重要参数并迅速给出不同层芯片的温度预测和可视化表征,实现对不同的堆叠结构参数的3D IC器件进行快速地温度分析.
Thermal Characteristics Analysis and Estimation in 3D ICs
Three-dimensional(3D)IC devices can significantly enhance system integration through 3D stacking.However,this increases the power density of the system and introduces significant thermal management challenges.To improve the thermal analysis of 3D IC devices,structural modeling of the 3D IC was performed.Furthermore,a thermal path analysis was conducted to estimate the temperature of the top-most chip layer.In addition,the effects of TSV structures and various TSV cross-sectional areas on the temperature of the active layer of the chip were considered.Finally,to improve the predictions of the temperature characteristics of the 3D ICs,the structural features and thermal analysis methods of the 3D ICs were integrated.A temperature prediction software for 3D ICs was developed using MATLAB,and its accuracy and efficiency were compared with those of a commercial CFD software.This advantage of the developed software lies in its ability to allow users to customize key parameters of the 3D IC and rapidly provide temperature predictions and visual representations for different chip layers,thus enabling rapid temperature analyses of 3D IC devices with various stacking structure parameters.
万方数据
维普
