System-in-package(SiP)stacking technology has gradually been adopted in high-density and high-performance integrated circuit packaging.In this study,the warpage of packaging in a reflow soldering stack process was analyzed through simulation,focusing on SiP stack packaging.The influence of the encapsulation thicknesses and thermal expansion coefficients of different encapsulation materials on packaging warpage was investigated.Results showed that during the heating stage of reflow soldering,the overall packaging exhibited convex deformation,whereas during the cooling stage,it exhibited concave deformation,with the maximum warpage occurring in the cooling stage.Increasing the encapsulation thickness reduced the warpage generated during the reflow soldering process,whereas an increase in the thermal expansion coefficient of the encapsulation material resulted in more severe warpage.Therefore,warpage in SiP stack packaging during the reflow soldering process can be effectively mitigated by both increasing the encapsulation thickness and reducing the thermal expansion coefficient of the encapsulation material.
reflow solderingSiP stacking packagingwarpagefinite element analysis
万方数据
维普
