Electrically conductive adhesives(ECAs)are an environmentally friendly alternative to Sn/Pb solders in electronics packaging applications.The main research concerns regarding ECAs are their bonding reliability,which greatly hinders the widespread application.This study explores the process for bonding Sn-and SnPb-terminated chip components through a series of carefully designed experiments.XRF,SEM,and EDS analyses were performed to elucidate the de-bonding mechanism between components metal terminations and the ECAs.The chemical reaction between rosin and oxide layers on the metal termination of the of components are deemed to be responsible for the de-bonding failure.
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