Research and Optimization of Long-term Reliability of Pin-interconnect Structure in a Temperature-varying Environment
Using a ceramic substrate-metal shell pin interconnection structure,the thermal stress distribution of the interconnect structure under temperature-varying loads was obtained via a temperature cycling test and finite element simulation.The results showed that the stress accumulation caused by the mismatch of the thermal expansion coefficient between the solder,pin,and ceramic substrate was the main reason for the crack formation in the interconnect structure after a long-term temperature cycling test.The optimization design of the pin-interconnect structure was proposed in this study.We showed that the optimized interconnect structure has high long-term reliability via simulation analysis and experiments.
interconnect structurethermal stresslong-term reliabilityfinite element analysis
万方数据
维普
