As one of the optional paths for post-Moore technology,integrated microsystems based on heterogeneous integration processes have the advantages of high integration,low cost,and high performance,which have attracted widespread attention in academia and industry.The system-centered multi-level collaborative design of heterogeneous integrated microsystem brings new challenges to the traditional transistor-centered design approach,and also brings new requirements to the development of the Electronic Design Automation(EDA)tools.This article reviews the latest advances in technologies such as basic device/structure modeling methods,multi-process hybrid Process Design Kit(PDK)technology,and circuit-module-system multi-level co-simulation,required in the design of radio frequency integrated microsystems.
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