Transient thermal analysis and optimization of a controller in a penetrating lunar soil detector
Focusing on the heat dissipation requirements of the controller in the penetrating lunar soil detector,this paper carries out the transient thermal simulation analysis by load steps in combination with the actual working process of the penetration landing,in order to obtain the instantaneous temperature distribution of each device of interest during the penetration process.Subsequently,a heat dissipation solution was proposed for the heat dissipation bottleneck devices,which included adding thermal via holes and laying copper on the surface of the substrate.Simulation results display that the temperature of the heat dissipation bottleneck devices decreases significantly.Further,the key thermal parameters including Specific heat capacity and thermal conductivity of potting adhesive,the main heat conduction material in the controller structure,were analyzed by Design of experiments Sensitivity analysis analysis.The binary linear regression analysis showed that the Specific heat capacity of potting adhesive had greater influence on the device temperature,providing a reference for the selection of module potting materials.
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