首页|Z型异质结Cu2O/Bi2MoO6的构建及光催化降解性能

Z型异质结Cu2O/Bi2MoO6的构建及光催化降解性能

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通过水热法制备出一系列Z型异质结Cu2O/Bi2MoO6新型光催化剂.采用扫描电子显微镜、粉末X射线衍射、红外光谱、紫外可见吸收光谱等表征手段研究了催化剂的形貌、结构性质和光电化学性质,并以四环素(TC)为降解目标污染物,进一步探究了其催化效率.实验结果表明,Cu2O的加入提高了复合催化剂的光催化性能,其中20％Cu2O/Bi2MoO6复合催化剂(Cu2O和Bi2MoO6的质量比为20％)降解效果最好,100 min内可降解95％的TC.Cu2O与Bi2MoO6之间的协同作用使其可以吸收更多的可见光,所构建的Z型异质结改变了电子转移途径,提高了电子与空穴的分离效率,光催化活性显著提高.通过自由基捕获实验和能带结构,分析了 Z型异质结Cu2O/Bi2MoO6复合催化剂光催化降解TC可能的机理.
Cu2O/Bi2MoO6 Z-type heterojunction:Construction and photocatalytic degradation properties
A series of Cu2O/Bi2MoO6 photocatalysts with Z-type heterojunction were prepared by hydrothermal meth-od.The morphology,structural properties,and photoelectrochemical properties of the catalyst were characterized by scanning electron microscopy,powder X-ray diffraction,IR spectroscopy,UV-Vis absorption spectroscopy,etc.The photocatalytic properties were investigated by tetracycline(TC)degradation.The experimental results showed that the photocatalytic performance of the composite was enhanced by adding Cu2O.Among them,20％Cu2O/Bi2MoO6 composite(The mass ratio of Cu2O and Bi2MoO6 was 20％.)exhibited the best degradation efficiency and 95％of TC was degraded within 100 min.The possible mechanism of photocatalytic degradation of TC by the Cu2O/Bi2MoO6 composite was analyzed through free radical capture experiments and band structure analysis.The absorption of visi-ble light is enhanced by the synergistic effect between Cu2O and Bi2MoO6 and the transfer pathway of electrons is changed by the constructed Z-type heterojunction.Thus,the separation efficiency of the electron-hole is improved and the photocatalytic activity is enhanced significantly.

photocatalystbismuth molybdatecuprous oxideCu2O/Bi2MoO6Z-scheme heterojunctiontetracycline

赵强、郭智楠、李淑英、王俊丽、李作鹏、贾治芳、王科伟、郭永

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山西大同大学化学与化工学院,大同 037009

山西省清洁能源材料联合实验室,大同 037009

光催化剂 钼酸铋 氧化亚铜 Cu2O/Bi2MoO6 Z型异质结 四环素

国家自然科学基金国家自然科学基金国家自然科学基金山西省省筹资金资助回国留学人员科研项目山西省省筹资金资助回国留学人员科研项目

2190813521975146522032662020-1342022-173

2024

10.11862/CJIC.20230435

无机化学学报
中国化学会

无机化学学报

CSTPCD北大核心
影响因子：0.665
ISSN：1001-4861
年,卷(期)：2024.40(5)
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